Mr. Subagaran LETCHUMANAN
Vice President, Design Engineering & General Manager, Malaysia Product Engineering, Intel Corporation
Suba is 26-year Intel veteran with vast experience across all manufacturing product development functions. He has successfully led global product development teams on Chipsets, ATOM SOCs, and High-Performance Computing (HPC). He has deep exposure across all Manufacturing/Test development functions and expertise spanning DFT, ATE test solutions, customer engagement, and silicon characterization. In his current role, Suba manages manufacturing product development operations in Malaysia for various business segments.
Presentation Title
Enhancing Manufacturing Cost Efficiency: Harnessing Artificial Intelligence & Machine Learning Solutions
Abstract
Traditional test methodologies struggle to keep pace with the complexity and scale of Advanced Packaging required in chip production today. While elevated costs are driven by the complexity of AI chip designs, paradoxically, AI itself offers a remedy. Leveraging AI and ML algorithms, manufacturers can optimize test processes, allocate resources efficiently and enhance fault detection accuracy. Additionally, the abundance of large datasets generated during manufacturing can provide invaluable insights. These datasets enable AI models to learn from historical test data, identify patterns and predict potential failures, thereby reducing test overheads. This abstract highlights the symbiotic relationship between AI solutions, large manufacturing datasets and cost-effective chip production in the AI era.