Mr. TAN Boo Wei

Mr. Tan Boo Wei is currently the Director of R & D at Amkor Technology Malaysia. His experience spans more than 29 years in the semiconductor packaging industry. Prior to joining Amkor, he held diverse roles encompassing R & D, engineering, technical sales and management in various IDM and OSAT companies across Singapore, China and Malaysia.

He has participated in the development of packaging technologies for numerous applications, including Analog, Industrial, RF and MEMS as well as CPU, GPU, 5G and more recently, SiC Power Packages.

Mr. Tan graduated from Nanyang Technological University (Singapore) in 1994, with a Bachelor of Electrical & Electronic Engineering.