Mr. Vempati Srinivasa Rao

Mr. Vempati Srinivasa Rao is Director at Heterogeneous Integration, Institute of Microelectronics (IME). He has over 15 years of R&D experience in microelectronics packaging, assembly, reliability, and failure analysis. He leads team to develop advanced wafer level packaging platform capabilities such as fine pitch multi-layer RDL, TSV interposer, W2W and C2W Hybrid Bonding required for heterogeneous chiplet integration.

He has authored or co-authored more than 70 journal and conference publications in electronic packaging area. His research interest includes chiplet integration using Fan-out wafer level packaging, Antenna-in-Package, 2.5D, 3D chip stacking.

He has a Masters in Mechanical Engineering from the National University of Singapore, and B.Tech in Metallurgical Engineering from the National Institute of Technology, Warangal, India.