Dr. Teck Kheng LEE

Dr. Lee Teck Kheng earned his B.S. in Mechanical Engineering and M.S. in Materials Science and Engineering from the National University of Singapore in 1995 and 1999, respectively, followed by a Ph.D. in Mechanical and Aerospace Engineering from Nanyang Technological University (NTU), Singapore, in 2006.

He is the Founder and CEO of Launchxtec Pte Ltd, offering specialised consultancy in semiconductor packaging, simulation, failure analysis, IoT applications in manufacturing, and facilities management. He is also an expert trainer in semiconductor packaging, delivering advanced technical courses to industry professionals. As a consultant with NTU, he has lectured in the M.Sc. programme on Failure Analysis for Semiconductor Packaging at the School of Materials Science and Engineering.

In 2008, Dr. Lee founded the Technology Development Centre at ITE College Central, driving strategic planning, organisational transformation, and innovation-led initiatives. Under his visionary leadership, the Centre secured over S$8 million in competitive grants, delivered more than 500 high-impact industry projects worth S$4 million, and successfully commercialised 10 licenses by 2025.

Earlier in his career, Dr. Lee was a Senior Technical Member at Micron Semiconductor Asia Pte Ltd (1999), managing global substrate suppliers and leading cutting-edge research in advanced packaging and material characterisation. Prior to that, from 1997 to 1999, at A*STAR’s Institute of Microelectronics (IME), he pioneered MEMS packaging and introduced early chip-scale and flip-chip packaging technologies.

Since 2005, Dr. Lee has delivered over 100 microelectronics packaging workshops worldwide under the banners of Laureate International, PDSC, and SEMI Singapore Pte Ltd. He has been invited as a keynote speaker, guest lecturer, and distinguished presenter at SEMI and IEEE events.

A recognised thought leader, Dr. Lee has published more than 80 papers in top-tier journals and international conferences and holds an exceptional 154 U.S. patents. He serves on the SEMI Technical committee, Singapore Chinese Chamber of Commerce and Industry (SCCCI) committee and, as co-convenor, represents Singapore in the review of IEC semiconductor standards. His specialised expertise in flip-chip technologies, especially thermocompression bonding, continues to influence advancements in the semiconductor sector. He also supports talent development as an industry advisory board member for the CESE at the University of Newcastle Institute of Higher Learning in Singapore.

Dr. Lee’s contributions have earned him numerous awards, including the SICC Award (2022), IEC 1906 Award (2023), MOE Synergy Awards (2021 & 2022), and consistent recognition in Who’s Who in the World (2007–2021). He was named among the International Biographical Centre’s Leading Engineers of the World (2013–2015) and received the Albert Nelson Marquis Lifetime Achievement Award. From 2015 to 2025, he has also been honoured with the highest corporate and establishment awards from ITE, underscoring his lasting impact on the industry.