Mr. Timothy KRYMAN

Tim Kryman is Senior Director of Films Product Marketing at Onto Innovation, with more than 20 years of experience with the company, including its legacy as Rudolph Technologies. Over the course of his career, Tim has held leadership roles spanning strategic account management, product management and marketing, and service management, focused on both customer needs and product strategy across the semiconductor industry. He holds a Bachelor of Science in Accounting and Information Systems from Lock Haven University and an MBA from DeSales University.

Presentation Title

Enabling Scalable AI Interconnects: Challenges and Solutions in Silicon Photonics and Co‑Packaged Optics

The rapid growth of artificial intelligence (AI) workloads is placing unprecedented demands on compute density, memory bandwidth, power efficiency, and interconnect performance. As traditional device scaling approaches reach practical limits, advanced packaging and silicon photonics have emerged as essential enablers of next generation AI hardware architectures. This paper reviews key process challenges and techniques that address device level performance and overall die yield in photonics and copackaging.

Advanced packaging approaches—including 2.5D and 3D integration, heterogeneous integration, chiplet architectures, advanced interposers, and high bandwidth memory (HBM)—enable tighter integration of logic and memory while improving bandwidth, latency, and power efficiency. These architectures introduce new challenges in thermal management, power delivery, signal integrity, and manufacturing complexity. In parallel, silicon photonics is transforming data movement through integrated optical interconnects, photonic integrated circuits, and hybrid material platforms, enabling high speed, low power I/O beyond the limits of electrical interfaces. Technologies such as co packaged optics are becoming increasingly critical as AI systems scale.

The paper concludes by highlighting the growing role of inspection, metrology, and process control in enabling yield, reliability, and high volume manufacturing of advanced AI packages and photonic devices. Together, these technologies form the foundation for scalable and energy efficient AI systems.

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