Mr. LEE Chee Ping

Lee Chee Ping is a Managing Director for Strategic Marketing at Lam Research, with over 22 years of experience in the semiconductor industry. His expertise spans advanced packaging and heterogeneous integration, where he leads strategic and technical marketing for Lam’s wafer- and panel-level equipment solutions. He plays a key role in mapping industry roadmap, understanding technology direction to shape Lam solutions and fostering collaboration across the semiconductor ecosystem. A recognized industry voice, Lee Chee Ping frequently shares insights at leading advanced semiconductor packaging conferences.

Lee Chee Ping received his M.Sc in Financial Engineering and B.Eng in Chemical Engineering from National University of Singapore.

Presentation Title

The Convergence of Wafer and Panel Level Technologies in Scaling AI Systems

AI is reshaping semiconductor scaling, shifting the performance engine beyond Moore’s Law toward system level innovation powered by advanced packaging. In this presentation, Lam Research shares how it is enabling the convergence of wafer and panel level technologies to support next generation AI systems. 

From high density HBM integration and hybrid bonding to chiplet stacking, co packaged optics, and large format panel processing, Lam’s equipment and process innovations address critical challenges in interconnect, yield, power, thermal performance, and warpage control. Through platform engineering, digital twins, and ecosystem co development, Lam Research is helping the industry scale AI performance sustainably and at manufacturable volume.

Back to Advanced Packaging & Heterogeneous Integration Summit