Mr. Kenneth THUM

Kenneth Thum is the Senior Area Technical Manager for Indium Corporation, based in Penang, Malaysia. He supports customers across northern Malaysia by troubleshooting complex electronics assembly challenges and providing technical expertise across Indium Corporation’s full range of materials and solutions. With 15 years of experience in the electronics assembly industry, Kenneth brings deep practical knowledge and a customer-focused approach to problem-solving. He is an SMTA Certified SMT Process Engineer (CSMTPE). Kenneth holds a Bachelor’s degree in CAD/CAM from the University of Malaya and an MBA from University Sains Malaysia (USM).

Presentation Title

Advanced Material Science Solutions for Next-Generation AI and Hyperscale Systems

The rapid growth of artificial intelligence (AI) and hyperscale computing is placing unprecedented demands on semiconductor manufacturing, spanning advanced packaging through system-level integration. Key challenges across this value chain include fine-pitch micro-bump interconnection, effective management of escalating thermal loads and localised hot spots, and mitigation of significant package warpage driven by increasingly large and complex architectures.

This presentation demonstrates how advanced material science enables solutions to these challenges. For high-density advanced packaging platforms such as CoWoS, a water-washable flux with superior wetting is required to enable fine-pitch micro-bump formation, while allowing residue-free cleaning and effectively preventing tin migration. To mitigate warpage-related defects in large-format packages at the system level, Durafuse® LT technology employs a patented mixed-powder metallurgy that enables low-temperature soldering at or below 210 °C, significantly reducing thermal stress while achieving drop shock and thermal cycling reliability that is equal to or exceeds that of industry-standard SAC305 alloys.

Thermal management challenges are addressed through a comprehensive portfolio of metal thermal interface materials (TIMs). High-conductivity solder TIMs deliver low interfacial resistance and efficient heat dissipation. For TIM1.5 and TIM2 interfaces, Heat-Spring® compressible metal technology provides a non-reflowed, mechanically compliant solution that maintains stable thermal performance even after 65,000 power cycles. These material solutions also support burn-in testing and system-level immersion cooling, ensuring reliability throughout the device lifecycle.

Through innovations in flux chemistry, low-temperature metallurgy, and advanced metal TIM technologies, material science provides the foundation for higher manufacturing yields, improved thermal performance, and long-term reliability in next-generation AI and hyperscale systems.

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