Dr. Jie WU

Dr. Jie Wu is a senior technical‑commercial leader with over 18 years of experience in the semiconductor and electronics industry across Southeast Asia. Based in Singapore, he specializes in advanced packaging, emerging business development, and application‑driven market expansion, with a strong focus on translating technology and customer needs into commercially viable opportunities. He is actively involved in industry and ecosystem collaboration and regularly participates in regional technical conferences and forums. Jie holds a Ph.D. in Micro‑Electro‑Mechanical Systems from Nanyang Technological University.

Presentation Title

High Thermal Conductive Underfill Materials for Improving Thermal Performance in Co-Packaged Optics

Co-packaged optics (CPO) is emerging as an important solution for high-speed computing and data center systems, where traditional electrical connections struggle to keep up with rising demands for speed and energy efficiency. By placing optical components very close to powerful processing chips, CPO shortens signal paths and improves performance. However, this close integration also creates significant heat and mechanical stress, especially because sensitive optical components must remain precisely aligned to function properly. Managing heat and maintaining stability therefore become critical challenges in these compact systems.

High thermal conductive capillary underfill (CUF) materials help solve these issues. Unlike conventional underfills that mainly provide mechanical support, thermally conductive CUFs are designed to both strengthen connections and efficiently transfer heat away from high-power components. Testing has shown that systems using thermally conductive underfill operate at lower temperatures and deliver better signal quality compared to those using standard materials. This improved thermal control helps maintain reliable optical performance and reduces strain on transmitters, contributing to overall system efficiency.

At the same time, these advanced underfills must be carefully engineered to flow into extremely small gaps without defects while still carrying heat effectively. They also need to minimize mechanical stress that could disturb delicate optical alignment over time. As demand grows for faster, more energy-efficient networks, especially in AI and high-speed data applications, thermally conductive capillary underfill has become a key enabling material. It supports thermal management, mechanical reliability, and long-term optical stability, making it essential for next-generation co-packaged optics solutions.

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