Dr. Faxing CHE

Faxing Che received the Ph.D. degree in Engineering Mechanics from Nanyang Technological University, Singapore, in 2006. 

He is a Senior Member of Technical Staff (SMTS) with Micron Semiconductor Asia Operations currently. Dr. Che has more than 20 years’ experience in advanced microelectronic packaging technologies in top industrial and academic organizations. 

Dr. Che was a recipient of 4 Best International Conference Paper Awards (EPTC2003, EPTC2013, Itherm2006, ICEPT2006). 

He has co-authored One Book and 180 Technical Papers in international Journals and conference proceedings in advanced microelectronics packaging area. 

He achieves 12 granted or published US Patents.

His Research Interests include AI-driven technical risk assessment (TRA) for advanced memory package, design for reliability in advanced packaging, Cu wire bonding, through silicon via (TSV) technology, fan-out wafer-level/panel-level packaging, finite-element modeling and simulation, and characterization of microelectronic packaging materials. 

Dr. Che is named in World’s Top 2% Scientists in 6 consecutive years from 2020 to 2025 by Stanford University. 

He is IEEE senior member.

Presentation Title

Accelerating Innovation and Reliability in Advanced Memory Packaging

Micron is at the forefront of developing advanced memory and storage products to meet the growing needs of diverse applications, particularly in data centers and artificial intelligence. The rapid pace of evolution and short product cycles in memory packaging present significant challenges in achieving optimal performance, capacity, efficiency, and reliability for advanced memory products.

To tackle these challenges, Micron employs several strategies designed to accelerate innovation and enhance reliability in advanced memory packaging. These include co-design and co-optimization methods, digital-twin technology, and AI-driven predictive modelling for early identification of potential risks, faster convergence on design solutions, and improved reliability in increasingly complex memory packages.

Through these innovative approaches, Micron accelerates the design process, and ensures high reliability for advanced memory packages, paving the way for continued advancements in data center and AI applications.

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