Dr. Szu Huat GOH

Szu Huat received his BEng and PhD in electrical and computer engineering from the National University of Singapore. He started his career with GLOBALFOUNDRIES, where he leads a team responsible for product failure diagnostics and advanced methodologies to accelerate yield ramp. He focuses on the development of wafer-level dynamic fault isolation techniques combining with cross-functional domain knowledge of design and test to enhance yield learning. His recent exploration centers on machine learning to enhance FA and yield prediction. He is currently with QUALCOMM yield management team where he is responsible for advanced technologies yield engineering and diagnostic. Szu Huat was the technical program chair, general co-chair and general chair for the International Physical and Failure Analysis (IPFA) in 2016, 2017 and 2018. He is also the co-editor for the Electronic Device Failure Analysis Magazine, ASM.