Mr. Clark TSENG
Senior Director, Market Intelligence Team, SEMI
Clark Tseng is the Senior Director of the Market Intelligent Team (MIT) at SEMI. He is responsible for developing and executing global strategies that provide high-quality market research products and services, which monitor and analyze the dynamics of the semiconductor manufacturing supply chain.
Clark specializes in analyzing and forecasting various microelectronics industries, such as IDM, Fabless, Foundry, Memory, and OSAT, with a focus on the Asia-Pacific and China markets. Additionally, he oversees SEMI's research partnerships across the globe.
Clark has held several strategic and analytical roles in leading microelectronics companies, before joining SEMI. At Mediatek, he served as the Deputy Director for the Computing, Connectivity, and Metaverse Business Group. In this role, Clark provided market intelligence and competitive analysis for Computing (HPC/ASIC), Connectivity (5G/Wi-Fi), and Multimedia (XR and Auto) domains. Prior to that, he was the Strategy and Business Development division manager at Qimonda, where he managed market and competitive intelligence functions in the Asia/Pacific region. Clark started his career as an analyst at IDC, covering semiconductor, flat panel display, and telecommunication markets.
Clark holds a Bachelor of Business Administration and a Bachelor of Arts in International Relations from National Chengchi University in Taiwan.
Presentation Title
SEMI Market Outlook: AI, Capacity Reality and Southeast Asia’s Expanding Role in the Semiconductor Supply Chain
AI infrastructure investment is reshaping the semiconductor market, pulling forward the path to a US$1 trillion industry and concentrating growth in advanced logic, HBM, networking, and data-center infrastructure. However, the industry is now moving from an AI demand surge into a capacity reality phase, where the key question is no longer whether demand exists, but how quickly capital investment can be converted into qualified, high-yield, and usable supply.
This presentation will examine the latest semiconductor market outlook, fab capacity expansion, equipment investment trends, and supply-chain bottlenecks shaping the industry through 2030. It will highlight how AI-centric investment is changing the balance between advanced and mature technologies, increasing pressure on packaging, test, memory, power, and materials supply chains. The discussion will also focus on Southeast Asia’s expanding role as a distributed semiconductor execution platform — spanning mature and mainstream technologies, packaging and test, WFE modules, EMS, data-center infrastructure, and emerging design capabilities.
The presentation will conclude with key implications for SEMICON Southeast Asia: AI is creating strong demand, but execution capacity — including talent, floor space, qualification speed, power readiness, materials reliability, and ecosystem depth — will determine how much value the region can capture in the next phase of semiconductor growth.