Mr. Byong-Jin KIM

Senior Director and R&D Department Manager
Amkor Technology, Malaysia

BJ Kim joined Amkor in 1999 and is currently responsible for Amkor Malaysia R&D team focused on power discrete package and technology development. Prior to joining Amkor Malaysia, BJ Kim led the advanced SiP/MEMS packaging development, Laminate package and Advanced Wafer level package design at Amkor Corp. R&D Center. He has more than 30 granted patents & several publications and holds a Master degree in material engineering from Inha University and MBA from KonKuk University, Korea.

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