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Dr. John LAU

Senior Technical Advisor
ASM Pacific Technology, Hong Kong

With more than 37 years of R&D and manufacturing experience in semiconductor packaging, John has published more than 440 peer-reviewed papers, 30 issued and pending patents, and 18 textbooks on, e.g., Advanced MEMS Packaging (McGraw-Hill Book Company, 2010), Reliability of RoHS compliant 2D and 3D IC Interconnects (McGraw-Hill Book Company, 2011), TSV for 3D Integration, (McGraw-Hill Book Company, 2013), and 3D IC Integration and Packaging (McGraw-Hill Book Company, 2016). John is an elected ASME Fellow and has been an IEEE Fellow since 1994.

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