Dr Gilbert See is head of advanced packaging process integration in Applied Packaging Development Center, Singapore. He has responsibilities for R&D, concept & feasibility testing for all of Applied packaging products in integrated process flow to support product releases as well as customer engagement.
He received his Ph.D in device physics from Nanyang Technological University in 2008 and earned his spot as a Member of Technical Staff from Technology Development in RF Device/Process Integration in Globalfoundries prior joining Applied Materials in 2015. He carried the experience and knowledge in device & process that are able to provide insightful know-how to enhance system integration in advanced packaging process integration for RF applications.
He is currently working to enable next-generation features of Fan-Out Wafer-level-packaging process.