Thought Leadership Exchange at SEMICON Southeast Asia 2020
SEMICON Southeast Asia is the ideal place to discover the technologies and trends that are driving advances in microelectronics to electronics manufacturing. From our series of technology and business forums, to conversations with our exhibiting companies, you will find ideas and solutions to your challenges, meet the people you need to know, and take away the information you need to advance your projects, innovations, and companies into the future.
The SEMI Southeast Asia Team works closely with their supporting committees and the manufacturing and R&D organizations to develop programs to match the specific needs of Southeast Asia's microelectronics and electronics ecosystem.
Learn insights from renowned international technology leaders and make an impact by presenting your technical solutions at the following technology symposiums
Technical Forums are supported by HRDF. [Applicable only for Malaysia Companies]
Theme: Transforming Technologies into Smart Solutions
2020 is the beginning of a new and exciting decade for innovation, transforming technologies into smart solutions. This era of industrial 4.0 and 5G connectivity offers many growth opportunities to transform industries and shape the future of advanced manufacturing and production. We invite high profile industry leaders in SiP, IC design, memory, wafer fabrication, packaging and testing and Minister from Trade Industry to share the opportunities in the cutting-edge technologies such as 5G, artificial intelligence, big data analytics and World of IoT.
Theme: Digitalization in the New Era of Manufacturability
Digitalization is powering innovation in the high-tech manufacturing, we witness the vast benefits it brings to the early adopters, with significant improvement in product quality, manufacturing efficiency, workforce health and safety, alongside with tremendous potential in skillset upgrading. The process of deriving to smart manufacturing is a journey, but surely a deserving effort. In this forum, key opinion leaders share their insights on this journey and the various solutions in the key aspects of innovation. Learn the best practices in data security and communication, machine learning with real-time processing methodologies, assets management with profit optimization.
The rise of new end-market applications like AI, 5G, IoT leads to the revolutions in semiconductor industry with continuous investment in leading-edge foundry and packaging technologies. Along with the growing investment, the uncertainties triggered by the rising cost of advanced node R&D and global market economy also increased. Industrial 4.0 together with digital transformation is an evolving journey. As the variety of opportunities increases so do customer expectations and digital transformation challenges. In this forum, we will cover a wide variety of market analysis from application to manufacturing, including an update of trends and drivers shaping these markets, geopolitical implications on business opportunities and challenges.
Theme: Heterogeneous Integration & Challenges in System Scaling and Performance in the 5G Era
As we are entering into an exciting era of digital transformation, to a world of new experience, we will witness the promise of 5G with seamless data transfer. It will couple with innovation of smart devices, accelerating the growth in connectivity, smart data analytics and artificial intelligence. With 5G technology in the works, demand for seamless data transfer and processing will only accelerate the growth. Having a super-powered device with multi-functions is an essential in this age. Device manufacturability with high level of integration will demand new requirements moving forward. In this need for integration, semiconductor packaging in being pushed to the fore front as a solution for performance, flexibility and cost. Heterogeneous Integration in SiP or modules is one of the most discussed solution given the multiple challenges. At this forum, we provide a platform for key opinion leaders from the industry to share the best practices and their innovative solutions to overcome these challenges. Learn the various packaging and assembly techniques that will guide you to resolve your technical challenges and exchange your perspectives at this interactive platform.
Theme: Device & System Level Test Challenges and Advancement for High-Performance Applications
Disruptive technologies bring the world into the new era of digitalization. With the rise in demand for such functionalities in applications like automotive, wireless communication, CMOS image sensors and IoT connectivity; stringent test & reliability requirements are expected. Test challenges in automotive System-on-Chips, high-density memory test challenges and emerging technologies such as 5G testing will be discussed in this forum. The forum will explore ways in the aspects on improving test efficiencies, metrology for yield enhancement and data predictability.
The Call for Abstract is now open!
Submit your suggested title with an abstract and biography by 31 January 2020*.
Speakers are encourage to take up exhibit space for further technical discussion and products promotion at the exhibit booths.
For details on Exhibit, please refer to Exhibitor Prospectus
*Note: Presentations are to be non-commercial and focus on technical merits of the solution
Selected speakers will be notified by early March 2020
- Program subject to further changes
- Rates quoted are inclusive of conference bento lunch & coffee/tea
- Malaysian Companies HRDF Claimable (Subject to T&C, Please contact HRDF for more information)
Leverage on this opportunity and demonstrate your solutions at the show floor.
Engage your target audience with live demonstration and secure an in-depth discussion with them at the floor.
Don’t miss out any chance at this annual congregation of high-tech electronics manufacturing ecosystem.