SEMICON SEA 2017 EXPOArena Exhibitors Seminar

Organised by:

Tuesday, 25 April 2017 | 11:00 – 15:00, 16:00 – 16:20hrs.
EXPOArena Stage, Outer Concourse Level 3, SPICE Arena
Time Presentation
11:00 - 11:30

Keynote Spotlight: Secure Connections for a Smarter World"

Dr. Hai WANG, Senior VP, Global Technology Innovation, NXP

12:00 - 12:30

Keynote Spotlight: "Virtual Reality: The New Era
Mr. David C.M. CHANG, Director, Corporate Development & Partnership, HTC

13:00 - 13:20

'E-Cap' - New Concept of Overmolding Methods

Mr Hideki MISAWA, Group Manager, Organic Electronics Materials Department, Shin-Etsu Chemical Co., Ltd.

13:30 - 13:50

High Speed 2D/3D Inspection Tool for Wafer Bumping Process

Mr. Yoko MIYAZAKI, Chief Manager, International Sales Department, NIDEC-READ Corporation

14:00 - 14:20

Can Fluids be a Cost-Effective Cooling Solution

Mr Amos WONG, Principal Engineer, 3M Singapore Pte Ltd

14:30 - 14:50

Big Data, the New Platform for Manufacturing Analytics

 Mr. Michael LIEW, Managing Consultant, NTT Data Business Solutions Singapore Pte Ltd

16:00 - 16:20 

Lam Research - Your Partner in Advanced Packaging

Mr LEE Chee Ping, Regional Technologist & Technical Marketing Manager, Advanced Packaging & MEMs Business Group, Lam Research

16:30 - 16:50

Thin Film Technologies as Key Enablers for Growth of the IoT

 Dr. Reinhard BENZ, Head of Strategic Sales and Product Marketing , Evatec AG, Switzerland

Wednesday, 26 April 2017 | 09:00 – 11:00hrs, 13:00 – 15:00, 16:00 – 16:30hrs.
EXPOArena Stage, Outer Concourse Level 3, SPICE Arena
Time Presentation
10:00 - 10:30

Keynote Spotlight: "The Digital Transformation

Mr. CHEAM Tong Liang, Vice President, Corporate Strategy, Kulicke & Soffa

10:30 - 10:50

Taking the Leap in the Future of Semiconductor Test System

Mr. Wei Ren NEO, Semiconductor Business Development Manager, National Instruments Southeast Asia Sdn Bhd

12:30 - 13:00

Keynote Spotlight: "How Data Analytics would transform High Tech Semiconductor Manufacturing in the Era of Big Data

Mr. CHU Jenn Weng, President & CEO, ViTrox

13:00 - 13:20

Dispensing Solution for Die Attach Processes

Mr Khoo Teang Lek, Regional Technical Support Manager, Nordson S.E. Asia (Pte) Limited

13:30 - 13:50

TMR Magnetic Sensing Technology - How it is being used in Next-Generation Sensing Applications

Mr. Tanios BOURAMIA, Product Line Manager - Sensors & Switches, Coto Technology, Inc.

14:00 - 14:20

Machinery Safety according to SEMI S2/S8 

Mr. LOH King Yew, Manager - Commercial Product, TÜV Rheinland

14:30 - 14:50

3M Technology to Support Future Packaging Trends in Semiconductor Components

Mr TL CHONG, Senior Application Specialist, 3M Malaysia Sdn Bhd

16:00 - 16:20

A Turnkey Solution of Wide Bandgap SiC – on Grinding, Polishing and Dicing

Ms. Gladys HUNG, Global Sales Department, Nippon Pulse Motor Trading (Taiwan) Co., Ltd.

Thursday, 27 April 2017 | 10:30 – 11:00 hrs, 12:00 – 12:30hrs.
EXPOArena Stage, Outer Concourse Level 3, SPICE Arena
Time Presentation
10:30 - 10:50

Trends, Challenges & Solutions in Modern Package Failure Analysis

Mr. Raleigh ESTRADA, Director of Marketing & Applications, Carl Zeiss Microscopy

12:00 - 12:20

MINISLIDE MSQscale - A unique Miniature Guideway with Integrated Measuring System & a Resolution of 0.1µm

Mr. Martin BAURIEDL, Head of Sales & Engineering (Divison Elements), SCHNEEBERGER AG

*Program subject to change without prior notice.
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