[Webinar] Advanced Packaging Forum

Friday, 14 August 2020 | 14:00–17:30hrs SGT | Registration Fee Applicable

 SEMI Member SGD 60 SGD 200
 Non-Member SGD 90 SGD 300
 Student (with valid student pass) SGD 30 SGD 50

 * Fee subject to 7% GST.
 * Registration opens in end June 2020.
 * All-in-One pass include all 8 webinars (refer to Agenda-at-a-Glance ).
 * For student registration code, please email your student pass to elim@semi.org

 * You will be required to create a SEMI account (for non-members) during registration in order to access SEMI webinars in our store.

Register now to save your seats! Get 3 passes at the price of 2 now!

REGISTER HERE Back to Agenda-at-a-Glance

Theme: Heterogeneous Integration & Challenges in System Scaling and Performance in the 5G Era

As we are entering into an exciting era of digital transformation, to a world of new experience, we will witness the promise of 5G with seamless data transfer. It will couple with innovation of smart devices, accelerating the growth in connectivity, smart data analytics and artificial intelligence. With 5G technology in the works, demand for seamless data transfer and processing will only accelerate the growth. Having a super-powered device with multi-functions is an essential in this age. Device manufacturability with high level of integration will demand new requirements moving forward. In this need for integration, semiconductor packaging in being pushed to the fore front as a solution for performance, flexibility and cost. Heterogeneous Integration in SiP or modules is one of the most discussed solution given the multiple challenges. At this forum, we provide a platform for key opinion leaders from the industry to share the best practices and their innovative solutions to overcome these challenges. Learn the various packaging and assembly techniques that will guide you to resolve your technical challenges and exchange your perspectives at this interactive platform.




Agenda: Advanced Packaging Forum - Friday, 14 August 2020

 Session 1 





Introduction by SEMI



Welcome Remarks by Moderator
Mr. Albert LAN, Senior Global Packaging Technical Director, Applied Materials Taiwan Ltd, Taiwan



Remote Equipment Control Centre (RECC) Approach for Smart Manufacturing and Productivity Improvement
Mr. Sanggaran SUBRAMANIAM, Equipment Manager, Assembly Operations, United Test and Assembly Center Ltd (UTAC), Singapore




Challenges in Placement Requirements for Heterogeneous Integration
Mr. Chan Pin CHONG, Executive Vice President & General Manager, Products & Solutions, Kulicke & Soffa Pte Ltd, Singapore




Innovative, Market Leading Solutions for Heterogeneous Integration
Mr. Chee Ping LEE, Senior Technologist and Technical Marketing Manager, Lam Research, Singapore


Inspection Challenges in 3D Stacking
Mr. Ravichander RAO, Product Marketing Manager, KLA Corporation, India







Closing Remarks for Session 1 by Moderator




 Session 2 




Welcome Remarks for Session 2 by Moderator



From 2.5D to 3D Heterogeneous Integration and its Process Challenges and Packaging Solution
Mr. Hoi Ping, Eric NG, Senior Business Development, ASM Pacific Technology, Hong Kong



Blanket Silicon Etching Processes for Advanced Packaging Applications including Via Reveal,
Extreme Thinning, FO-WLP and Post-Grind Smoothing

Dr. Dave THOMAS, Vice President, Product Management, SPTS Technologies Ltd, United Kingdom



Deep Data Chip Telemetry for Quality & Reliability Monitoring of Heterogeneous Packaging
Mr. Nir SEVER, Senior Director of Product Marketing, proteanTecs, Israel






Closing Remarks by Moderator

Agenda subject to further changes without prior notice

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