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Innovation Leadership for Advanced Packaging by Applied Materials

@My9, North Wing, Level 1A, MITEC Tuesday, May 22
1:00pm to 5:00pm
Free by Registration

 UPDATED! 

 

THEME: INNOVATION LEADERSHIP FOR ADVANCED PACKAGING

Please join us at SEMICON Southeast Asia 2018 for a lunch reception followed by a half-day program exploring various innovative and cost effective advanced wafer level packaging solutions to enable better and more effective multi-die sysytem integration.

Register Now

Presentations from Applied Materials and our invited guest speakers will provide an overview of the advanced packaging market and technology roadmap. The session will also include deep dives into various cost and technical challenges across different packaging schemes and showcase how Applied’s integrated solutions for 2.5D/3D & FOWLP are helping to drive on-wafer performance for improved device performance and yield.

We look forward to seeing you there.

Who should attend: Personnel from Fabless companies and IDMs, turn-key supply chain management and OSATs

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PROGRAM DETAILS

SEMICON Southeast Asia 2018
Malaysia International Trade and Exhibition Centre Kompleks (MITEC)
No. 8, Jalan Dutamas 2 
50480 Kuala Lumpur, Malaysia Meeting Room @My9 (North Wing), Level 1A 

MAY 22, 2018 
12:00-13:00  Registration & Lunch
13:00-17:00 Technical Seminar

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SYNOPSIS

Cost Effective Advanced Wafer Level Packaging Solutions for Multi Die System Integration

The continual drive for performance and product differentiation has created an advanced packaging inflection with the need for better and more efficient system integration. Advanced packaging for System Integration (SI), because of the versatility it offers as compared to System-on-Chip (SoC), is a viable solution. While heterogeneous integration with 2.5D-interposer or 3D has primarily been used for high end (large packages) applications, the introduction of Fan-Out wafer-level packaging (FOWLP) provides a more cost effective and versatile packaging scheme to realize packaged SI with recent demand being driven by high-end mobile and other high-performance applications that require multi-die packaging. To continue to drive adoption of packaged Si, the industry will need to address forthcoming technical challenges while developing new cost effective solutions to improve Cost of ownership (CoO), Electrical performance, Yield, and Reliability. 

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For questions, email AMSEA_Marketing@amat.com

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