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IC Failure Analysis and Defects Characterisation Forum (4)

@My1-4, North Wing, Level 1A, MITEC Wednesday, May 23
9:30am to 4:30pm

 

Thank you for your participation at SEMICON Southeast Asia 2018!

Hope the event was fruitful for your business matching, technical learning and networking!

We will see you next year 7-9 May 2019 in Kuala Lumpur again.

Post Show Report will be ready by end of June.

For inquiry, please contact Ms. Candice Lim at clim@semi.org or +65 6391 9518.


My1-4 (North Wing), Level 1A, MITEC | Wednesday, May 23 | 9:30am to 4:30pm | Paid

IC Failure Analysis and Defects Characterisation Forum

Theme: Transformation of Defect Root Causation in the age of IoT

Synopsis: There are four main driving forces for the semiconductor industry. 1) The race to produce faster and smaller front-end devices; 2) Challenges and innovations in new packaging technology in light of product and system miniaturization, 3) proliferation in the diverse applications relating to IoT devices and their rapid paced evolution 4) increasing complexity of our systems and technologies in a competitive environment. Last year's edition of the forum, we addressed extensively about failure diagnostic on advanced packaging device challenges; this year we intend to focus on IoT.

By nature of IoT, the value of the chips are not measured just by its performance. The chips are being put to a multitude of targeted industries which include mobile, displays, automobiles, manufacturing, utilities, and others. Therefore, the other requirements of an IoT chip such as power consumption, durability, cost-effectiveness and turnaround time-to-production are integral components of the entire value chain. Failure analysis and defect characterization can play an important role to ensure the quality of a chip. Flaws as a result of either process or design constraints, or both, are inevitable in the early stages of a tapeout. Particularly, on the point of effective and efficient defect root causation, this forum seeks to broaden defect diagnostics perspectives and shares insights into the symbiotic relation between inline defect characterization and failure analysis in faster and more effective fault isolation in the semiconductor devices.

Session Chair:
Dr. GOH Szu Huat
Senior Manager, Product Diagnostics Engineering | GLOBALFOUNDRIES Singapore Pte Ltd, Singapore

Sponsors:

             

          

* Program below subject to change without prior notice.


 Proceedings 

Kindly note only proceedings with explicit permission from the speakers are shared below and with only registered attendees of this forum. 

 

Opening Address: Relevance of Machine Learning to Failure Debug by Dr. GOH Szu Huat, GLOBALFOUNDRIES Singapore Pte Ltd, Singapore
[Please contact szuhuat.goh@globalfoundries.com]
 

 

Electronic Fault Isolation on Cutting-Edge Technology Nodes - NanoProbing in Failure Analysis by Dr. Andrew Jonathan SMITH, Kleindiek Nanotechnik, Germany
 

Physical Unclonable Function (PUF)-Security Enabled FPGA for Medical Solutions in IoT by Ir. Dr. Norhayati SOIN, University of Malaya, Malaysia
 

 

RMA Root Cause Investigation 20nm Technology by Mr. Mike von den HOFF, KLA-Tencor Corporation, Europe
 

 

Laser-Based Inspection Technique for Non-Visual Defects by Dr. Cheolkyu KIM, Rudolph Technologies, Inc, Korea
 

 

How to Meet Extreme IoT Yield Demands on Mature Process Nodes with Volume Diagnosis and Statistical Yield Analysis by Dr. Martin KEIM, Mentor, A Siemens Business, USA
 

 

Fault Isolation of 2.5D and 3D Packages Through Analysis Across Entire System by Mr. Ankush OBERAI & Ms. Rupa KAMOJI, Synopsys, USA & India
 

 

Probing and Measurement of Material Properties Using Advanced Surface Characterization Tools for Successful Failure Analysis Investigations by Dr. Suhairi SAHARUDIN, MIMOS Semiconductor (M) Sdn Bhd, Malaysia

Do you want to attend this session? Register for SEMICON SEA

Dr. GOH Szu Huat [Technical Committee Chairman]
Senior Manager, Product Diagnostics Engineering
GLOBALFOUNDRIES Singapore Pte Ltd, Singapore
Dr. Cheolkyu KIM
Director of PCG Applications Asia
Rudolph Technologies, Inc, Korea
Mr. Ankush OBERAI
Group Director, R&D
Synopsys Inc, USA
Ms. Rupa KAMOJI
Senior Manager, R&D
Synopsys India Pvt Ltd, India
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