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IC Failure Analysis and Defects Characterisation Forum
Theme: Transformation of Defect Root Causation in the age of IoT
Synopsis: There are four main driving forces for the semiconductor industry. 1) The race to produce faster and smaller front-end devices; 2) Challenges and innovations in new packaging technology in light of product and system miniaturization, 3) proliferation in the diverse applications relating to IoT devices and their rapid paced evolution 4) increasing complexity of our systems and technologies in a competitive environment. Last year's edition of the forum, we address extensively about failure diagnostic on advanced packaging device challenges; this year we intend to focus on IoT.
By nature of IoT, the value of the chips are not measured just by its performance. The chips are being put to a multitude of targeted industries which include mobile, displays, automobiles, manufacturing, utilities, and others. Therefore, the other requirements of an IoT chip such as power consumption, durability, cost-effectiveness and turnaround time-to-production are integral components of the entire value chain. Failure analysis and defect characterization can play an important role to ensure the quality of a chip. Flaws as a result of either process or design constraints, or both, are inevitable in the early stages of a tapeout. Particularly, on the point of effective and efficient defect root causation, this forum seeks to broaden defect diagnostics perspectives and shares insights into the symbiotic relation between inline defect characterization and failure analysis in faster and more effective fault isolation in the semiconductor devices.
* Program below subject to change without prior notice and time allotment of the speakers will be confirmed in mid April.