Versatility in X-ray Inspection for the Electronics Manufacturing Industry

Tuesday, May 22
1:30pm to 2:00pm

As technology moves in to a new level of ever shrinking dimensions, and ever-increasing complexity, the requirements for the X-ray inspection microscope needs consideration in its system configuration.

Whether used for Electronic Manufacturing of Printed Circuit Board Assembly, (PCBA) or for Semiconductor Manufacture, the fundamental components that make up the inspection system will vary in operation and design.

With the need for High Resolution X-ray to qualify the image integrity, at the smallest component geometry, the flexibility of the inspection technique needs to be considered to achieve the best utilization of the inspection system.

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