Advanced Packaging Forum (3)

Wednesday, May 09
10:00am to 5:00pm

SEMICON SEA 2018 Technical Forums are fully claimable by Human Resources Development Fund (HRDF) !
100% Claimable under the Skim Bantuan Latihan (SBL) for eligible Malaysian companies.

REGISTER NOW! Early Bird Rates Available Now! Forum pass include teabreaks and lunch. Get connected. Learn new insights and win lucky draw prizes!

Early Bird Rates
SEMI Member: USD120 / SGD165
Non-Member: USD155 / SGD210
Additional 15% discount off Early Bird rate for group registration if you register 3 pax and above!

Advanced Packaging Forum

Theme: Advanced Packaging Solution for Heterogeneous Integration

Synopsis: In an era where SMART is the buzz word, smart communication, smart connectivity, smart factory, smart transportation, smart living, smart nations and more, the ability to sense, connect and share data at any time, and any place have been the pre-requisites.

There is a tremendous push in the semiconductor packaging towards heterogeneous integration through the use of advanced packaging technologies to integrate multiple functionalities like MEMs, sensors, RF, memory, ASIC etc. Some of the advanced packaging technologies are 2.5/3D, FO-WLP, SIPs (embedded substrate), TSV etc. This forum will take a holistic look of the various advanced packaging technology innovation that has been used or can be used to enable heterogeneous integration.

* Program below subject to change without prior notice and time allotment of the speakers will be confirmed in mid April.

Do you want to attend this session? Register for SEMICON SEA

Mr. LEE Chee Ping
SEA Sales, Regional Technologist & Technical Marketing Manager
Lam Research Corporation
Mr. Gilbert SEE
Manager, Strategic Product Marketing
Applied Materials Singapore Technology
Mr. YONG Wae Chet
Director of Backend Development for SON platform
Infineon Technologies
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