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Advanced Packaging Forum (3)

@My9-10, North Wing, Level 1A, MITEC Wednesday, May 23
9:30am to 4:30pm

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Forum Agenda Speakers' Profile & Abstract
(Files are subject to further updates)

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Rates
SEMI Member: USD140 / SGD190 / MYR550*
Non-Member: USD180 / SGD245 / MYR720*
Additional 15% discount off rates for group registration if you register 3 pax and above!
*MYR payment will be collected onsite and in cash only.

My9-10 (North Wing), Level 1A, MITEC | Wednesday, May 23 | 9:30am to 4:30pm | Paid

Advanced Packaging Forum

Theme: Advanced Packaging Solution for Heterogeneous Integration

Synopsis: In an era where SMART is the buzz word, smart communication, smart connectivity, smart factory, smart transportation, smart living, smart nations and more, the ability to sense, connect and share data at any time, and any place have been the pre-requisites.

There is a tremendous push in the semiconductor packaging towards heterogeneous integration through the use of advanced packaging technologies to integrate multiple functionalities like MEMs, sensors, RF, memory, ASIC etc. Some of the advanced packaging technologies are 2.5/3D, FO-WLP, SIPs (embedded substrate), TSV etc. This forum will take a holistic look of the various advanced packaging technology innovation that has been used or can be used to enable heterogeneous integration.

   

 

 

Session Chair:
Ms. Lily KHOR
Group Manager, Research & Development | Carsem Technology Center, Malaysia

   
   

 

 

Session Co-Chair:
Dr. TAN Juan Boon
Director | GLOBALFOUNDRIES Singapore Pte Ltd, Singapore

Sponsors:

                       

               

     

* Program below subject to change without prior notice.

Do you want to attend this session? Register for SEMICON SEA

Mr. Byong-Jin KIM
Senior Director and R&D Department Manager
Amkor Technology, Malaysia
Mr. LEE Chee Ping
Senior Manager, Technologist & Technical Marketing
Lam Research Corporation, Singapore
Mr. CHONG Chan Pin
Senior Vice President, EA/APMR and Wedge Bonders Business Units
Kulicke & Soffa Pte Ltd, Singapore
Mr. YONG Wae Chet
Director Package Development
Infineon Technologies (M) Sdn Bhd, Malaysia
Dr. Gilbert SEE
Packaging Process Integration Manager
Applied Materials Singapore Technology, Singapore
Mr. YU Xiang
Gas Application Manager, Technical Application in Electronic Packaging and Assembly
Air Products and Chemicals (China) Investment Co Ltd, China
Ms. LIM Sze Pei
Regional Product Manager, Semiconductor
Indium Corporation, Malaysia
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