Advanced Packaging Forum (3)

MY 11 | Level 1A | MITEC Wednesday, May 08
9:30am to 5:00pm
Registration Fee Applicable

*Programs and Topics are subject to change without prior notice
** Malaysia Companies HRDF Claim , Please click to download the Letter of Endorsement from HRDF. (Subject to T&C and please contact HRDF for more information)

Track Theme: The Driving Trend in Advanced Packaging for Emerging Applications and factory connectivity

Synopsis: In continuation of last year theme in Advanced Packaging forum on Advanced Packaging Solution for Heterogeneous Integration, this year forum delves further into the needs for emerging applications. Beside investing in packaging techniques advancement for integrated applications, the driving trend is to integrate into a full system of high performance and functionality devices with smart manufacturing. The connected system in packaging world shall drive for yield performance excellence in high-tech manufacturing. 

The topics look into the learning of technique advancement for driving applications in Asia and take a peek on how factory connevtivity brings benefits to backend manufacturing. 
An interactive panel discussion will have an exchange of insights by the industry leaders. 



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Do you want to attend this session? Register for SEMICON SEA

Mr. Favier SHOO
Yole Développement, Singapore
Mr. LOH Jan Sing
Director, Package Development
Infineon Technologies (Malaysia) Sdn. Bhd. Melaka, Malaysia
Mr. LEE Chee Ping
Senior Technologist & Technical Marketing Manager
Lam Research Corporation, Singapore
Mr. CHONG Chan Pin
Senior Vice President, EA/APMR and Wedge Bonders Business Units
Kulicke & Soffa Pte Ltd, Singapore
Mr. Albert LAN
Global Packaging Senior Technical Director
Applied Materials, Taiwan
Mr. Eric NG Hoi Ping
Senior Business Development Engineer
ASM Pacific Technology
Business Development Manager Semiconductors
Precitec Optronik GmbH, Germany
Business Development Mgr, SEA
Universal Instruments, Philippines
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