Advanced Packaging Forum (3)

@My9-10, North Wing, Level 1A, MITEC Wednesday, May 23
9:30am to 4:30pm


Thank you for your participation at SEMICON Southeast Asia 2018!

Hope the event was fruitful for your business matching, technical learning and networking!

We will see you next year 7-9 May 2019 in Kuala Lumpur again.

Post Show Report will be ready by end of June.

For inquiry, please contact Ms. Candice Lim at clim@semi.org or +65 6391 9518.

My9-10 (North Wing), Level 1A, MITEC | Wednesday, May 23 | 9:30am to 4:30pm | Paid

Advanced Packaging Forum

Theme: Advanced Packaging Solution for Heterogeneous Integration

Synopsis: In an era where SMART is the buzz word, smart communication, smart connectivity, smart factory, smart transportation, smart living, smart nations and more, the ability to sense, connect and share data at any time, and any place have been the pre-requisites.

There is a tremendous push in the semiconductor packaging towards heterogeneous integration through the use of advanced packaging technologies to integrate multiple functionalities like MEMs, sensors, RF, memory, ASIC etc. Some of the advanced packaging technologies are 2.5/3D, FO-WLP, SIPs (embedded substrate), TSV etc. This forum will take a holistic look of the various advanced packaging technology innovation that has been used or can be used to enable heterogeneous integration.




Session Chair:
Ms. Lily KHOR
Group Manager, Research & Development | Carsem Technology Center, Malaysia




Session Co-Chair:
Dr. TAN Juan Boon
Director | GLOBALFOUNDRIES Singapore Pte Ltd, Singapore





* Program below subject to change without prior notice.


Kindly note only proceedings with explicit permission from the speakers are shared below and with only registered attendees of this forum. 

Recent Trend of Advanced Materials for Semiconductor Devices by Dr. Takenori FUJIWARA, Toray Industries Inc, Japan
[Please request for password from clim@semi.org as it differs from the one shared after the survey. Thank you.]

The ‘SMART-er’ Approach to Electronics Packaging by Mr. CHONG Chan Pin, Kulicke & Soffa Pte Ltd, Singapore


Power “Electronification”: Demands in Efficiency and Integration by Mr. YONG Wae Chet, Infineon Technologies (M) Sdn Bhd, Malaysia


Production-scale Flux-free Wafer Bump Reflow by Activated Hydrogen by Mr. YU Xiang, Air Products and Chemicals (China) Investment Co Ltd, China 
[Please contact NEOY@airproducts.com or YUX4@airproducts.com​]


Challenges in Material Selection for SIP Applications by Ms. LIM Sze Pei, Indium Corporation, Malaysia

Do you want to attend this session? Register for SEMICON SEA

Mr. Byong-Jin KIM
Senior Director and R&D Department Manager
Amkor Technology, Malaysia
Mr. LEE Chee Ping
Senior Manager, Technologist & Technical Marketing
Lam Research Corporation, Singapore
Mr. CHONG Chan Pin
Senior Vice President, EA/APMR and Wedge Bonders Business Units
Kulicke & Soffa Pte Ltd, Singapore
Mr. YONG Wae Chet
Director Package Development
Infineon Technologies (M) Sdn Bhd, Malaysia
Dr. Gilbert SEE
Packaging Process Integration Manager
Applied Materials Singapore Technology, Singapore
Mr. YU Xiang
Gas Application Manager, Technical Application in Electronic Packaging and Assembly
Air Products and Chemicals (China) Investment Co Ltd, China
Ms. LIM Sze Pei
Regional Product Manager, Semiconductor
Indium Corporation, Malaysia
Share page with AddThis