CONNECT. LEARN . FEEL
SEMICON SEA 2018 Technical Forums are fully claimable by Human Resources Development Fund (HRDF) !
100% Claimable under the Skim Bantuan Latihan (SBL) for eligible Malaysian companies.
Technical Forums at SEMICON Southeast Asia 2018
SEMICON Southeast Asia is the ideal place to discover the technologies and trends that are driving advances in microelectronics to electronics manufacturing. From our series of technology and business forums, to conversations with our exhibiting companies, you will find ideas and solutions to your challenges, meet the people you need to know, and take away the information you need to advance your projects, innovations, and companies into the future.
The SEMI Southeast Asia Team works closely with their supporting committees and the manufacturing and R&D organizations to develop programs to match the specific needs of Southeast Asia's microelectronics and electronics ecosystem.
(1) Market Trends Briefing
Synopsis: Semiconductor industry leapfrogged beyond expectation and set a new milestone in of semiconductor revenue of more than USD400 billion in 2017. Indeed 2017 was a record-setting year for the entire semiconductor supply chain industry with growth expected to continue into this year as new semiconductor applications for the industrial, automotive, artificial intelligence, and consumer markets proliferate at an ever-increasing rate.
In this half a day Market Trend forum, subject matter experts from the chip makers, market research analysts covering equipment and materials, applications domain and advanced packaging space as well as financial analyst will share with you the latest current industry trends and drivers for 2018 and beyond.
(2) Electronics Assembly Technologies Forum by SMTA
(3) Advanced Packaging Forum
(4) Keynotes on Technology Innovation Forum
Theme: Technology Innovation Forum - Smart Manufacturing Keynote Speech
Synopsis: What does Smart Manufacturing mean for the future of the electronics manufacturing supply chain? The electronics manufacturing supply chain holds many different perspectives, but one thing is clear ─ the impact of Smart Manufacturing will be huge.
Recent advances and low-cost technologies for sensing, connecting, and analyzing masses of data has push the boundary of next generation of disruptive improvement in even the highly sophisticated world of semiconductor and electronics systems manufacturing. Advanced automation and sensing technology coupled with highly sophisticated advanced data analytics now offer the semiconductor manufacturing sector an opportunity to better integrate automation and structural data from separate silos to drive actionable and optimized manufacturing efficiencies.
The Technology Innovation forum on Smart Manufacturing Keynote Speech from presenters across the electronics manufacturing supply chain offers relevant and thoughtful insights of how Smart Manufacturing is revolutionizing the semiconductor manufacturing industry.
(5) MEMs and Sensors Technology Forum
(6) Product & System Level Test Forum
(7) IC Failure Analysis and Defect Characterisation Forum
Theme: Transformation of Defect Root Causation in the age of IoT
Synopsis: There are four main driving forces for the semiconductor industry. 1) The race to produce faster and smaller front-end devices; 2) Challenges and innovations in new packaging technology in light of product and system miniaturization, 3) proliferation in the diverse applications relating to IoT devices and their rapid paced evolution 4) increasing complexity of our systems and technologies in a competitive environment. Last year's edition of the forum, we address extensively about failure diagnostic on advanced packaging device challenges; this year we intend to focus on IoT.
By nature of IoT, the value of the chips are not measured just by its performance. The chips are being put to a multitude of targeted industries which include mobile, displays, automobiles, manufacturing, utilities, and others. Therefore, the other requirements of an IoT chip such as power consumption, durability, cost-effectiveness and turnaround time-to-production are integral components of the entire value chain. Failure analysis and defect characterization can play an important role to ensure the quality of a chip. Flaws as a result of either process or design constraints, or both, are inevitable in the early stages of a tapeout. Particularly, on the point of effective and efficient defect root causation, this forum seeks to broaden defect diagnostics perspectives and shares insights into the symbiotic relation between inline defect characterization and failure analysis in faster and more effective fault isolation in the semiconductor devices